SiC Device와 ZTA AMB 기판 적용 파워모듈의 무가압 Silver Sintering 접합특성 (Pressureless Silver Sintering Property of SiC Device and ZTA AMB Substrate for Power Module)

서지정보

· 발행기관 : 대한용접접합학회
· 수록지 정보 : 대한용접접합학회지 / 37권 / 2호 / 15 ~ 20페이지
· 저자명 : 김미송, 오철민, 홍원식

초록

We have developed pressureless silver sintering module using zirconia toughened alumina (ZTA) substrate made of active metal brazing (AMB) and SiC device for power module. The silver paste was printed with a metal mask of 80, 120, and 150 ㎛ thickness, respectively. The void content was measured by x-ray images after pressureless silver sintering under a vacuum and nitrogen atmosphere. In order to evaluate the durability against thermal stress of the sintered module, the thermal cycle test (TC) and the high temperature storage test (HTS) were conducted. The void content and bond strength before and after the environment test were measured. As a result, the void content did not change, but the bonding strength was decreased after TC and increased after HTS. Crack was generated at between silver sintered joint and ZTA substrate after TC test. Also, we observed that Cu-Ag alloy layer was formed between the copper AMB and silver sintered layer after HTS, which finally leaded to improve the bonding strength.

영어초록

We have developed pressureless silver sintering module using zirconia toughened alumina (ZTA) substrate made of active metal brazing (AMB) and SiC device for power module. The silver paste was printed with a metal mask of 80, 120, and 150 ㎛ thickness, respectively. The void content was measured by x-ray images after pressureless silver sintering under a vacuum and nitrogen atmosphere. In order to evaluate the durability against thermal stress of the sintered module, the thermal cycle test (TC) and the high temperature storage test (HTS) were conducted. The void content and bond strength before and after the environment test were measured. As a result, the void content did not change, but the bonding strength was decreased after TC and increased after HTS. Crack was generated at between silver sintered joint and ZTA substrate after TC test. Also, we observed that Cu-Ag alloy layer was formed between the copper AMB and silver sintered layer after HTS, which finally leaded to improve the bonding strength.

참고자료

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