압연 클래드된 Ti/Mild steel/Ti 재의 계면확산층과 접합력에 미치는 후열처리온도의 영향 (Effect of Post Heat Treatment Temperature on Interface Diffusion Layer and Bonding Force in Roll Cladded Ti/Mild steel/Ti Material)

서지정보

· 발행기관 : 대한금속·재료학회
· 수록지 정보 : 대한금속·재료학회지 / 50권 / 4호 / 316 ~ 323페이지
· 저자명 : 이상목, 김수민, 위세나, 배동현, 이근안, 이종섭, 김용배, 배동수

초록

The aim of this study is to investigate the effect of post heat treatment on bonding properties of roll cladded Ti/MS/Ti materials. First grade Ti sheets and SPCC mild steel sheets were prepared and then Ti/MS/Ti clad materials were fabricated by a cold rolling and post heat treatment process. Microstructure and point analysis of the Ti/MS interfaces were performed using the SEM and EDX Analyser. Diffusion bonding was observed at the interfaces of Ti/MS. The thickness of the diffusion layer increased with post heat treatment temperature and the diffusion layer was verified as having (ε+ζ)+(ζ+β-Ti) intermetallic compounds at 700℃ and an (ζ+β-Ti) intermetallic compound at 800℃, respectively. The micro Knoop hardness of mild steel decreased with post heat treatment temperature; however, those of Ti decreased at a range of 500~600℃ and showed a uniform value until 800℃ and then increased rapidly up to 900℃. The micro Knoop hardness value of the diffusion layer increased up to 700℃ and then saturated with post heat treatment. A T-type peel test was used to estimate the bonding forces of Ti/Mild steel interfaces. The bonding forces decreased up to 800℃ and then increased slightly with post heat treatment. The optimized temperature ranges for post heat treatment were 500~600℃ to obtain the proper formability for an additional plastic deformation process.

영어초록

The aim of this study is to investigate the effect of post heat treatment on bonding properties of roll cladded Ti/MS/Ti materials. First grade Ti sheets and SPCC mild steel sheets were prepared and then Ti/MS/Ti clad materials were fabricated by a cold rolling and post heat treatment process. Microstructure and point analysis of the Ti/MS interfaces were performed using the SEM and EDX Analyser. Diffusion bonding was observed at the interfaces of Ti/MS. The thickness of the diffusion layer increased with post heat treatment temperature and the diffusion layer was verified as having (ε+ζ)+(ζ+β-Ti) intermetallic compounds at 700℃ and an (ζ+β-Ti) intermetallic compound at 800℃, respectively. The micro Knoop hardness of mild steel decreased with post heat treatment temperature; however, those of Ti decreased at a range of 500~600℃ and showed a uniform value until 800℃ and then increased rapidly up to 900℃. The micro Knoop hardness value of the diffusion layer increased up to 700℃ and then saturated with post heat treatment. A T-type peel test was used to estimate the bonding forces of Ti/Mild steel interfaces. The bonding forces decreased up to 800℃ and then increased slightly with post heat treatment. The optimized temperature ranges for post heat treatment were 500~600℃ to obtain the proper formability for an additional plastic deformation process.

참고자료

· 없음