무전해 Cu 도금층의 두께와 표면조도에 미치는 도금조건의 영향 (Effects of Plating Conditions on Thickness and Surface Roughness of Electroless-Plated Cu Deposits)

서지정보

· 발행기관 : 대한금속·재료학회
· 수록지 정보 : 대한금속·재료학회지 / 54권 / 4호 / 237 ~ 245페이지
· 저자명 : 이기환, 박상진, 한준현

초록

Copper thin films were coated on polyethylene terephthalate(PET) substrates by electroless plating. The effects of the ultra-sonication, the initial roughness of the PET substrates, and the plating time on the thickness and roughness of the electroless-plated Cu deposits were studied. The thickness and roughness of the Cu deposits were measured by scanning electron microscopy(SEM) observations and a surface profiler. In the early stage of Cu plating, the ultra-sonication and high initial roughness of the PET substrates promoted an increase in the thickness of the Cu deposits, but they suppressed the increase in thickness of the Cu deposits when plated for a long time. The surface roughness of the Cu deposits plated on PET with a very low initial roughness increased with plating time due to the agglomeration of Cu atoms. However, the surface roughness of the Cu deposits on the PET with a high initial roughness decreased with increasing plating time, since the deep valleys of the rough PET surface were filled with Cu atoms preferentially.

영어초록

Copper thin films were coated on polyethylene terephthalate(PET) substrates by electroless plating. The effects of the ultra-sonication, the initial roughness of the PET substrates, and the plating time on the thickness and roughness of the electroless-plated Cu deposits were studied. The thickness and roughness of the Cu deposits were measured by scanning electron microscopy(SEM) observations and a surface profiler. In the early stage of Cu plating, the ultra-sonication and high initial roughness of the PET substrates promoted an increase in the thickness of the Cu deposits, but they suppressed the increase in thickness of the Cu deposits when plated for a long time. The surface roughness of the Cu deposits plated on PET with a very low initial roughness increased with plating time due to the agglomeration of Cu atoms. However, the surface roughness of the Cu deposits on the PET with a high initial roughness decreased with increasing plating time, since the deep valleys of the rough PET surface were filled with Cu atoms preferentially.

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