자동차 전장품용 무연솔더 접합부의 시리즈 시험 유효성 (Validation of sequence test method of Pb-free solder joint for automotive electronics)

서지정보

· 발행기관 : 대한용접접합학회
· 수록지 정보 : 대한용접접합학회지 / 33권 / 3호 / 25 ~ 31페이지
· 저자명 : 김아영, 오철민, 홍원식

초록

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotiveelectronics have to eliminate toxic substance from electronic devices and system. Specifically, reliabilityissue of lead-free solder joint have an increasing demand for the car electronics caused by ELVbanning. The authors prepared engine control unit and cabin electronics soldered with Sn-3.0Ag-0.5Cu(SAC305). To compare with the degradation characteristics of solder joint strength, thermal cycling test(TC), power-thermal cycling test (PTC) and series tests were conducted. Series tests were conducted forTC and PTC combined stress test using the same sample in sequence and continuously. TC test was performedat -40~125 ℃ and soak time 10 min for 1000 cycles. PTC test was applied by pulse power andfull function conditions during 100 cycles. Combined stress test was tested in accordance with automotivecompany standard. Solder joint degradation was observed by optical microscopy and environment scanningelectron microscopy (ESEM). In addition, to compare with deterioration of bond strength of quad flat package(QFP) and chip components, we have measured lead pull and shear strength. Based on the series testresults, consequently, we have validated of series test method for lifetime and reliability of Pb-free solderjoint in automotive electronics.

영어초록

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotiveelectronics have to eliminate toxic substance from electronic devices and system. Specifically, reliabilityissue of lead-free solder joint have an increasing demand for the car electronics caused by ELVbanning. The authors prepared engine control unit and cabin electronics soldered with Sn-3.0Ag-0.5Cu(SAC305). To compare with the degradation characteristics of solder joint strength, thermal cycling test(TC), power-thermal cycling test (PTC) and series tests were conducted. Series tests were conducted forTC and PTC combined stress test using the same sample in sequence and continuously. TC test was performedat -40~125 ℃ and soak time 10 min for 1000 cycles. PTC test was applied by pulse power andfull function conditions during 100 cycles. Combined stress test was tested in accordance with automotivecompany standard. Solder joint degradation was observed by optical microscopy and environment scanningelectron microscopy (ESEM). In addition, to compare with deterioration of bond strength of quad flat package(QFP) and chip components, we have measured lead pull and shear strength. Based on the series testresults, consequently, we have validated of series test method for lifetime and reliability of Pb-free solderjoint in automotive electronics.

참고자료

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