끓는점 제어를 이용한 PMMA 열접합 시스템 (PMMA Thermal Bonding System Using Boiling Point Control)

서지정보

· 발행기관 : 한국정밀공학회
· 수록지 정보 : 한국정밀공학회지 / 38권 / 8호 / 613 ~ 618페이지
· 저자명 : 박동진, 박태현

초록

A method for thermoplastic fusion bonding was introduced using a commercial pressure cooker as a thermal bonding chamber to apply heat and pressure for polymer thermal bonding. The chamber pressure was controlled by simplymodifying the regulator weight, which decided the boiling point of water in the chamber. In this experiment, Poly-Methyl Methacrylate (PMMA) was thermally bonded using the proposed technique. For PMMA thermal bonding, 52 grams of regulator weight was well matched for 26.2 kPa of chamber pressure. The corresponding boiling temperature of water to the pressure was 105.5oC, which was the glass transitional temperature of PMMA. The thermal bonding systemdemonstrated bonding between the PMMA sheet and PMMA film without deformation of the microchannel. The bonding strength was characterized at 195.5±1 N.

영어초록

A method for thermoplastic fusion bonding was introduced using a commercial pressure cooker as a thermal bonding chamber to apply heat and pressure for polymer thermal bonding. The chamber pressure was controlled by simplymodifying the regulator weight, which decided the boiling point of water in the chamber. In this experiment, Poly-Methyl Methacrylate (PMMA) was thermally bonded using the proposed technique. For PMMA thermal bonding, 52 grams of regulator weight was well matched for 26.2 kPa of chamber pressure. The corresponding boiling temperature of water to the pressure was 105.5oC, which was the glass transitional temperature of PMMA. The thermal bonding systemdemonstrated bonding between the PMMA sheet and PMMA film without deformation of the microchannel. The bonding strength was characterized at 195.5±1 N.

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