Tensile Strength Property with PdCo-Cu Multi-Layer Lamination and Heat Treatment of MEMS Probe for Probe Card

서지정보

· 발행기관 : 대한용접접합학회
· 수록지 정보 : 대한용접접합학회지 / 42권 / 5호 / 560 ~ 566페이지
· 저자명 : 현소희, 김미송, 홍원식, 이재형, 이태종

초록

Cantilever wire probe card has limited to transport high-speed signal because of long wire but it is suitable for inspecting high-current and high voltage semiconductor such as wide band gap (WBG) power semiconductors.
Superior mechanical property of a probe card wire is in demand because it is respectively used wafer inspection with in and out pad on the top surface of the power semiconductor wafer. Therefore, in this study, tensile specimens of micro electro-mechanical systems (MEMS) probe alternatively layered and electroplated with palladium (Pd)-cobalt (Co) alloy layers and copper (Cu) layers. MEMS probe was also measured tensile strength and elongation with multilamination and heat treatment conditions. Additionally, fractography of fracture surface after tensile test were analyzed using a scanning electron microscope (SEM). As the number of PdCo-Cu multi-layer increased, 11, 15 and 21 layered specimens showed higher tensile strength and longer elongation than 5 layered specimens because of the increase of laminated interface of PdCo and Cu. 7 layered specimen after isothermal aging had higher tensile strength and longer elongation than before isothermal aging. In 5, 11, 15 and 21 layered specimens, the fracture surfaces of tensile test specimens without aging treatment showed a ductile-brittle mixed fracture mode. Fracture surfaces of 7-layered specimen before and after isothermal aging showed a ductile-brittle mixed fracture mode.

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