코어-쉘 입자를 사용한 금속 접합부 형성의 최근 연구 동향과 입자 종류에 따른 접합 특성 리뷰 (A Review of Recent Research Trends of Forming of Metallic Bondlines Using Core-Shell Particles and Bonding Properties According to Particle Type)

서지정보

· 발행기관 : 대한금속·재료학회
· 수록지 정보 : 대한금속·재료학회지 / 61권 / 9호 / 679 ~ 693페이지
· 저자명 : 한병조, 김영중, 이종현

초록

With the increasing numbers of electric vehicles and the prevalence of high heat generating devices,recent studies have attempted to address the limitations of conventional solder materials, including their lowdurability at temperatures exceeding 200 oC, insufficient mechanical properties in a joint, and low thermalconductivity. Transient liquid-phase (TLP) partial bonding using solders or Sn, and sinter bonding using Agparticles, are alternative bonding methods which involve a modification or change of the material. Advancedalternatives can significantly reduce bonding time or material cost. Various additional studies haveinvestigated various core-cell particles that can be used to form an all-metallic bondline. This reviewsummarizes reports of bonding studies using different core-cell particles. The particles were not only appliedas a form of paste but also preform. In the TLP bonding using X(Cu, Ag, Ni)@Sn particles, the degree of voidsgenerated in the formed bondline was dependent on the type of intermetallic compound formed. The preformsconsisting of X@Sn particles provided relatively uniform microstructure and void distribution, compared tothe pastes containing identical X@Sn particles, resulting in better long-term mechanical reliability. Theaddition of Zn@Sn particles contributed to the more practical control of microstructure and mechanicalproperties in the joint formed by pure Sn and Sn-58Bi solder alloys. Cu@Ag particles can be considered apromising low-cost material for compression-assisted sinter bonding, replacing pure Ag particles. Theapplication of core-cell particles is expected to improve the processes used for forming metallic bondlines.

영어초록

With the increasing numbers of electric vehicles and the prevalence of high heat generating devices,recent studies have attempted to address the limitations of conventional solder materials, including their lowdurability at temperatures exceeding 200 oC, insufficient mechanical properties in a joint, and low thermalconductivity. Transient liquid-phase (TLP) partial bonding using solders or Sn, and sinter bonding using Agparticles, are alternative bonding methods which involve a modification or change of the material. Advancedalternatives can significantly reduce bonding time or material cost. Various additional studies haveinvestigated various core-cell particles that can be used to form an all-metallic bondline. This reviewsummarizes reports of bonding studies using different core-cell particles. The particles were not only appliedas a form of paste but also preform. In the TLP bonding using X(Cu, Ag, Ni)@Sn particles, the degree of voidsgenerated in the formed bondline was dependent on the type of intermetallic compound formed. The preformsconsisting of X@Sn particles provided relatively uniform microstructure and void distribution, compared tothe pastes containing identical X@Sn particles, resulting in better long-term mechanical reliability. Theaddition of Zn@Sn particles contributed to the more practical control of microstructure and mechanicalproperties in the joint formed by pure Sn and Sn-58Bi solder alloys. Cu@Ag particles can be considered apromising low-cost material for compression-assisted sinter bonding, replacing pure Ag particles. Theapplication of core-cell particles is expected to improve the processes used for forming metallic bondlines.

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