전열용 저항체(전자빔 필라멘트) 연구 - 전자빔 필라멘트 분석 및 CAE 해석 (Resistors for Heating(electron beam filament) Study – Electron Beam Filament Analysis and CAE Analysis)

서지정보

· 발행기관 : 한국기계기술학회
· 수록지 정보 : 한국기계기술학회지 / 24권 / 5호 / 1007 ~ 1012페이지
· 저자명 : 이정익

초록

Thin-film shape technology is recognized for its core technology to enhance the technology of LCD, PDP, semiconductor manufacturing processes, hard disks and optical disks, and is widely used to form coated thin films of products. In addition, resistance(electron beam filament) technology for heating is used to manufacture filament for ion implants used in semiconductor manufacturing processes. By establishing an electronic beam filament production system and developing seven specifications of electronic beam filament, it is contributing to improving trade dynamics and increasing exports to Japan through localized media of theoretical imports to domestic companies. In this study, CAE analysis was performed after setting electron beam filament specification and development objectives, facilities and fabrication for electron beam filament production, electron beam filament JIG & fixture design and fabrication followed by electron beam filament prototype. Then, the automation and complete inspection equipment of the previously developed electronic beam filament manufacturing facilities was developed and researched to mass-produce them, to analyze and modify prototypes, design and manufacture automation facilities, and finally, to design and manufacture the complete inspection equipment. In this paper, mainly electron beam filament specification analysis and development objectives and CAE analysis were dealted with.

영어초록

Thin-film shape technology is recognized for its core technology to enhance the technology of LCD, PDP, semiconductor manufacturing processes, hard disks and optical disks, and is widely used to form coated thin films of products. In addition, resistance(electron beam filament) technology for heating is used to manufacture filament for ion implants used in semiconductor manufacturing processes. By establishing an electronic beam filament production system and developing seven specifications of electronic beam filament, it is contributing to improving trade dynamics and increasing exports to Japan through localized media of theoretical imports to domestic companies. In this study, CAE analysis was performed after setting electron beam filament specification and development objectives, facilities and fabrication for electron beam filament production, electron beam filament JIG & fixture design and fabrication followed by electron beam filament prototype. Then, the automation and complete inspection equipment of the previously developed electronic beam filament manufacturing facilities was developed and researched to mass-produce them, to analyze and modify prototypes, design and manufacture automation facilities, and finally, to design and manufacture the complete inspection equipment. In this paper, mainly electron beam filament specification analysis and development objectives and CAE analysis were dealted with.

참고자료

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