LTCC기판과 BGA 솔더접합부의 계면반응 및 기계적 특성 (Interfacial Reaction and Mechanical Property of BGA Solder Joints with LTCC Substrate)

서지정보

· 발행기관 : 대한금속·재료학회
· 수록지 정보 : 대한금속·재료학회지 / 47권 / 3호 / 202 ~ 208페이지
· 저자명 : 유충식, 하상수, 서원찬, 정승부, 김배균, 장진규

초록

The effects of aging time on the microstructure and shear strength of the Low Temperature Cofired
Ceramic (LTCC)/Ag pad/Electroless Nickel Immersion Gold (ENIG)/BGA solder joints were investigated
through isothermal aging at 150°C for 1000 h with conventional Sn-37Pb and Sn-3Ag-0.5Cu. Ni3Sn4
intermetallic compound (IMC) layers was formed at the interface between Sn-37Pb solder and LTCC substrate
as-reflowed state, while (Ni,Cu)3Sn4 IMC layer was formed between Sn-3Ag-0.5Cu solder and LTCC substrate.
Additional (Cu,Ni)6Sn5 layer was found at the interface between the (Ni,Cu)3Sn4 layer and Sn-3Ag-0.5Cu
solder after aging at 150oC for 500 h. Thickness of the IMC layers increased and coarsened with increasing
aging time. Shear strength of both solder joints increased with increasing aging time. Failure mode of BGA
solder joints with LTCC substrate after shear testing revealed that shear strength of the joints depended on
the adhesion between Ag metallization and LTCC. Fracture mechanism of Sn-37Pb solder joint was a mixture
of ductile and pad lift, while that of Sn-3Ag-0.5Cu solder joint was a mixture of ductile and brittle (Ni,Cu)3Sn4
IMC fracture morphology. Failure mechanisms of LTCC/Ag pad/ENIG/BGA solder joints were also interpreted
by finite element analyses.

영어초록

The effects of aging time on the microstructure and shear strength of the Low Temperature Cofired
Ceramic (LTCC)/Ag pad/Electroless Nickel Immersion Gold (ENIG)/BGA solder joints were investigated
through isothermal aging at 150°C for 1000 h with conventional Sn-37Pb and Sn-3Ag-0.5Cu. Ni3Sn4
intermetallic compound (IMC) layers was formed at the interface between Sn-37Pb solder and LTCC substrate
as-reflowed state, while (Ni,Cu)3Sn4 IMC layer was formed between Sn-3Ag-0.5Cu solder and LTCC substrate.
Additional (Cu,Ni)6Sn5 layer was found at the interface between the (Ni,Cu)3Sn4 layer and Sn-3Ag-0.5Cu
solder after aging at 150oC for 500 h. Thickness of the IMC layers increased and coarsened with increasing
aging time. Shear strength of both solder joints increased with increasing aging time. Failure mode of BGA
solder joints with LTCC substrate after shear testing revealed that shear strength of the joints depended on
the adhesion between Ag metallization and LTCC. Fracture mechanism of Sn-37Pb solder joint was a mixture
of ductile and pad lift, while that of Sn-3Ag-0.5Cu solder joint was a mixture of ductile and brittle (Ni,Cu)3Sn4
IMC fracture morphology. Failure mechanisms of LTCC/Ag pad/ENIG/BGA solder joints were also interpreted
by finite element analyses.

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