자동차 전장용 무연솔더 및 솔더 접합부의 신뢰성 평가 (Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint)

서지정보

· 발행기관 : 대한용접접합학회
· 수록지 정보 : 대한용접접합학회지 / 34권 / 1호 / 26 ~ 34페이지
· 저자명 : 방정환, 유동열, 고용호, 윤정원, 이창우

초록

Automotive today has been transforming to an electronic product by adopting a lot of convenience and safetyfeatures, suggesting that joining materials and their mechanical reliabilities are getting more important. In thisstudy, a Sn-Cu-Cr-Ca solder composition having a high melting temperature (>230℃) was fabricated and itsjoint properties and reliability was investigated with an aim to evaluate the suitability as a joining materialfor electronics of engine room. Furthermore, mechanical properties change under complex environment were comparedwith several existing solder compositions. As a result of contact angle measurement, favorable spreadability of84% was shown and the average shear strength manufactured with corresponding composition solder paste was1.9kg/mm2. Also, thermo-mechanical reliability by thermal shock and vibration test was compared with that ofthe representative high temperature solder materials such as Sn-3.5Ag, Sn-0.7Cu, and Sn-5.0Sb. In order tofabricate the test module, solder balls were made in joints with ENIG-finished BGA and then the BGAchip was reflowed on the OPS-finished PCB pattern. During the environmental tests, resistance change wascontinuously monitored and the joint strength was examined after tests. Sn-3.5Ag alloy exhibited the biggestdegradation rate in resistance and shear stress and Sn-0.7Cu resulted in a relatively stable reliability againstthermo-mechanical stress coming from thermal shock and vibration.

영어초록

Automotive today has been transforming to an electronic product by adopting a lot of convenience and safetyfeatures, suggesting that joining materials and their mechanical reliabilities are getting more important. In thisstudy, a Sn-Cu-Cr-Ca solder composition having a high melting temperature (>230℃) was fabricated and itsjoint properties and reliability was investigated with an aim to evaluate the suitability as a joining materialfor electronics of engine room. Furthermore, mechanical properties change under complex environment were comparedwith several existing solder compositions. As a result of contact angle measurement, favorable spreadability of84% was shown and the average shear strength manufactured with corresponding composition solder paste was1.9kg/mm2. Also, thermo-mechanical reliability by thermal shock and vibration test was compared with that ofthe representative high temperature solder materials such as Sn-3.5Ag, Sn-0.7Cu, and Sn-5.0Sb. In order tofabricate the test module, solder balls were made in joints with ENIG-finished BGA and then the BGAchip was reflowed on the OPS-finished PCB pattern. During the environmental tests, resistance change wascontinuously monitored and the joint strength was examined after tests. Sn-3.5Ag alloy exhibited the biggestdegradation rate in resistance and shear stress and Sn-0.7Cu resulted in a relatively stable reliability againstthermo-mechanical stress coming from thermal shock and vibration.

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