알루미늄 합금의 복사방열향상을 위한 코팅연구 (The Study on Coatings to Improve the Radiative Heat Dissipation of Aluminum Alloy)

서지정보

· 발행기관 : 한국표면공학회
· 수록지 정보 : 한국표면공학회지 / 46권 / 5호 / 208 ~ 215페이지
· 저자명 : 서미희, 김동현, 이정훈, 정원섭

초록

The aim of the present study was to improve the radiative heat dissipation of aluminum alloy, Al 1050.
Resin/CuO coating and Cu/CuO composite plating were applied on aluminum alloy to improve the radiativeheat dissipation. Resin/CuO coating was made using thermosetting silicon resin and Cu/CuO composite platingwas made in pyrophosphate copper plating bath. Radiant heat flux(W/m2) was measured by self-producedradiant heat measurement device to compare each specimen. The cross section of specimen and chemicalbonding of surface were analyzed by FE-SEM, XPS and FT-IR. As a result, radiant heat of Resin/CuO coatingwas higher than Cu/CuO composite plating due to the adhesion with aluminum plate and the difference inchemical bonding. But, Both of them were higher than aluminum alloy. In order to confirm the result ofexperiment, aluminum plate, Resin/CuO coating and Cu/CuO composite plating sample were applied LEDand measured the LED temperature. As a result, LED temperature of samples were matched previous resultsand confirmed coated samples were lower about 10 degrees than the aluminum alloy.

영어초록

The aim of the present study was to improve the radiative heat dissipation of aluminum alloy, Al 1050.
Resin/CuO coating and Cu/CuO composite plating were applied on aluminum alloy to improve the radiative heat dissipation. Resin/CuO coating was made using thermosetting silicon resin and Cu/CuO composite plating was made in pyrophosphate copper plating bath. Radiant heat flux(W/m2) was measured by self-produced radiant heat measurement device to compare each specimen. The cross section of specimen and chemical bonding of surface were analyzed by FE-SEM, XPS and FT-IR. As a result, radiant heat of Resin/CuO coating was higher than Cu/CuO composite plating due to the adhesion with aluminum plate and the difference in chemical bonding. But, Both of them were higher than aluminum alloy. In order to confirm the result of experiment, aluminum plate, Resin/CuO coating and Cu/CuO composite plating sample were applied LED and measured the LED temperature. As a result, LED temperature of samples were matched previous results and confirmed coated samples were lower about 10 degrees than the aluminum alloy.

참고자료

· 없음