Bendable 임베디드 전자모듈의 손상 메커니즘 (Failure Mechanism of Bendable Embeded Electronic Module Under Various Enviroment Condition)

서지정보

· 발행기관 : 대한용접접합학회
· 수록지 정보 : 대한용접접합학회지 / 31권 / 5호 / 59 ~ 63페이지
· 저자명 : 조윤성, 김아영, 홍원식

초록

A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-rollmanufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in apolymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliabilityand durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level,thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Thoseexperiments to induce failure of the module due to temperature variations and moisture are the experimentto verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. Themechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysisand scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at thevarious interfaces of the bendable embedded modules. To investigate the failure mechanism, moisturediffusion analysis was conducted to the pressure cooker’s test. The hygroscopic characteristics of theencapsulating polymeric materials were experimentally determined. Analysis results have shown moisturesaturation process of flexible module under high temperature/high humidity and high atmosphere conditions.
Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic modulewere obtained.

영어초록

A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-rollmanufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in apolymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliabilityand durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level,thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Thoseexperiments to induce failure of the module due to temperature variations and moisture are the experimentto verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. Themechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysisand scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at thevarious interfaces of the bendable embedded modules. To investigate the failure mechanism, moisturediffusion analysis was conducted to the pressure cooker’s test. The hygroscopic characteristics of theencapsulating polymeric materials were experimentally determined. Analysis results have shown moisturesaturation process of flexible module under high temperature/high humidity and high atmosphere conditions.
Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic modulewere obtained.

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