Candle Filter를 이용한 반도체 폐수의 Si 입자 제거 시 Media의 Precoating 조건 (The Precoating Condition in the Removing Si Particle of the CMP Wastewater Using the Candle Filter)

서지정보

· 발행기관 : 한국수처리학회
· 수록지 정보 : 한국수처리학회지 / 22권 / 4호 / 23 ~ 31페이지
· 저자명 : 강민구, 신관우, 이한슬, 강한솔, 이상일

초록

In this study, it used the candle filter in order to remove the Si particle of CMP wastewater which is generally produced from semiconductor industry. The chemical mechanical polishing (CMP) wastewater is the super pure water as the water come out of the semiconductor process with including the partial silica particle and occupies 40% of the effluent generated in the process of manufacturing semiconductor. If this process is formed in the media surface after the predetermined time flows, the quality of water of the treated water is improved. By using this concept, the treatment was possible which is the partial silica in the shortest possible time. The pre-coating used the CMP and Back grind wastewater and it measured and compared the Si particle removal ratio with the flow rate and turbidity. The time to use Back grind was the pore size blocked within the time to be faster than the CMP wastewater and the flow rate of the effluent which is treated was fast. So Back grind wastewater is suitable Pre-coating process. The Pre-coating process was finished and the CMP wastewater was filtered later. There was no difference from two media and the silica concentration of the effluent flowed out investigated the removal ratio exceeded 90% altogether.

영어초록

In this study, it used the candle filter in order to remove the Si particle of CMP wastewater which is generally produced from semiconductor industry. The chemical mechanical polishing (CMP) wastewater is the super pure water as the water come out of the semiconductor process with including the partial silica particle and occupies 40% of the effluent generated in the process of manufacturing semiconductor. If this process is formed in the media surface after the predetermined time flows, the quality of water of the treated water is improved. By using this concept, the treatment was possible which is the partial silica in the shortest possible time. The pre-coating used the CMP and Back grind wastewater and it measured and compared the Si particle removal ratio with the flow rate and turbidity. The time to use Back grind was the pore size blocked within the time to be faster than the CMP wastewater and the flow rate of the effluent which is treated was fast. So Back grind wastewater is suitable Pre-coating process. The Pre-coating process was finished and the CMP wastewater was filtered later. There was no difference from two media and the silica concentration of the effluent flowed out investigated the removal ratio exceeded 90% altogether.

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