소산입자동역학을 이용한 에폭시 접착 소재 구성에 따른 미시적 모폴로지 분석 (Investigation on Microscopic Morphological Variation of Epoxy Adhesives by Dissipative Particle Dynamics Simulations)

서지정보

· 발행기관 : 한국섬유공학회
· 수록지 정보 : 한국섬유공학회지 / 60권 / 6호 / 400 ~ 407페이지
· 저자명 : 최주희, 이승걸

초록

Epoxy structural adhesives are widely used in various industries due to theirexcellent chemical resistance, thermal properties, high electrical insulation performance,increased joint stiffness, and potential for lightweighting in structural components. Whilethe performance of epoxy adhesives is influenced by various factors such as chemicalstructures and compositions, it is challenging to analyze the structural morphology ofepoxy adhesives at the molecular level. Therefore, in this study, we investigated macroscopicstructural changes in epoxy adhesive materials based on the changes of componentsusing dissipative particle dynamics (DPD) simulations. By calculating DPDparameters and simulating the degree of affinity interaction between the epoxy components,we represented the morphological characteristics according to their chemical structure.
Through DPD simulations, we analyzed the number density, density field distribution,and diffusion coefficient of structure for each epoxy compositions, revealing that 3,3’-diamino diphenyl sulfone (3,3’-DDS) strongly interact with triglycidyl aminophenol (TGAP)and diglycidyl ether of bisphenol A (DGEBA), and polyether sulfone (PES) has repulsiveinteraction with TGAP, resulting in significant phase separation.

영어초록

Epoxy structural adhesives are widely used in various industries due to theirexcellent chemical resistance, thermal properties, high electrical insulation performance,increased joint stiffness, and potential for lightweighting in structural components. Whilethe performance of epoxy adhesives is influenced by various factors such as chemicalstructures and compositions, it is challenging to analyze the structural morphology ofepoxy adhesives at the molecular level. Therefore, in this study, we investigated macroscopicstructural changes in epoxy adhesive materials based on the changes of componentsusing dissipative particle dynamics (DPD) simulations. By calculating DPDparameters and simulating the degree of affinity interaction between the epoxy components,we represented the morphological characteristics according to their chemical structure.
Through DPD simulations, we analyzed the number density, density field distribution,and diffusion coefficient of structure for each epoxy compositions, revealing that 3,3’-diamino diphenyl sulfone (3,3’-DDS) strongly interact with triglycidyl aminophenol (TGAP)and diglycidyl ether of bisphenol A (DGEBA), and polyether sulfone (PES) has repulsiveinteraction with TGAP, resulting in significant phase separation.

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