풀비등에서 소형 사각기둥핀 배열형상에 따른 FC-72의 응축특성 (Condensing Characteristics of Pin-finned Surfaces on Pool Boiling in FC-72)

서지정보

· 발행기관 : 대한설비공학회
· 수록지 정보 : 설비공학 논문집 / 23권 / 7호 / 498 ~ 504페이지
· 저자명 : 강상우, 김서영

초록

As the electronic industry rapidly develops, the heat flux from state-of-the-art electronics increases up to 10^6 W/m^2. For this reason, the development of a new cooling technology for high heat flux applications is strongly required. Recently, some cooling technologies using boiling and condensation of working fluid are being adopted to overcome such a technical barrier. In the present study, a smooth boiling surface (14×14 mm^2) was immersed in FC-72 and its vapor was condensed by four different types of condensation surfaces (30×30 mm^2 base). The condensing surfaces were composed of a smooth surface and 1×1 mm^2 pin-finned surfaces of 2 mm height with 0.3, 0.5 and 1 mm array spacing. Boiling and condensing characteristics were investigated in detail on their combinations of boiling and condensing surfaces. For a smooth boiling surface the results obtained showed that the pin-finned condensing surface with 1 mm array spacing yielded the best performance and the smooth condensation surface did the worst. Furthermore hysteresis phenomena could be reduced by using enhanced condensing surfaces.

영어초록

As the electronic industry rapidly develops, the heat flux from state-of-the-art electronics increases up to 10^6 W/m^2. For this reason, the development of a new cooling technology for high heat flux applications is strongly required. Recently, some cooling technologies using boiling and condensation of working fluid are being adopted to overcome such a technical barrier. In the present study, a smooth boiling surface (14×14 mm^2) was immersed in FC-72 and its vapor was condensed by four different types of condensation surfaces (30×30 mm^2 base). The condensing surfaces were composed of a smooth surface and 1×1 mm^2 pin-finned surfaces of 2 mm height with 0.3, 0.5 and 1 mm array spacing. Boiling and condensing characteristics were investigated in detail on their combinations of boiling and condensing surfaces. For a smooth boiling surface the results obtained showed that the pin-finned condensing surface with 1 mm array spacing yielded the best performance and the smooth condensation surface did the worst. Furthermore hysteresis phenomena could be reduced by using enhanced condensing surfaces.

참고자료

· 없음