단결정 다이아몬드공구 제작 기술을 통한 초정밀 미세패턴 가공 연구 (Research on ultra-precision fine-pattern machining through single crystal diamond tool fabrication technology)

서지정보

· 발행기관 : 한국금형공학회
· 수록지 정보 : Design & Manufacturing / 14권 / 3호 / 63 ~ 70페이지
· 저자명 : 정성택, 송기형, 최영재, 백승엽

초록

As the consumer market in the VR(virtual reality) and the head-up display industry grows, the demand for5-axis machines and grooving machines using on a ultra-precision machining increasing. In this paper, ultra-precisiondiamond tools satisfying the cutting edge width of 500 were developed through the process research of a focused ionbeam. The material used in the experiment was a single-crystal diamond tool (SCD), and the equipment for machiningthe SCD used a focused ion beam. In order to reduce the influence of the Gaussian beam emitted from the focused ionbeam, the lift-off process technology used in the semiconductor process was used. 2.9 of Pt was coated on the surfaceof the diamond tool. The sub-micron tool with a cutting edge of 492.19 was manufactured through focused ion beammachining technology. Toshiba ULG-100C(H3) equipment was used to process fine-pattern using the manufacturedultra-precision diamond tool. The ultra-precision machining experiment was conducted according to the machiningdirection, and fine burrs were generated in the pattern in the forward direction. However, no burr occurred during reversemachining. The width of the processed pattern was 480 and the price of the pitch was confirmed to be 1 As aresult of machining.

영어초록

As the consumer market in the VR(virtual reality) and the head-up display industry grows, the demand for5-axis machines and grooving machines using on a ultra-precision machining increasing. In this paper, ultra-precisiondiamond tools satisfying the cutting edge width of 500 were developed through the process research of a focused ionbeam. The material used in the experiment was a single-crystal diamond tool (SCD), and the equipment for machiningthe SCD used a focused ion beam. In order to reduce the influence of the Gaussian beam emitted from the focused ionbeam, the lift-off process technology used in the semiconductor process was used. 2.9 of Pt was coated on the surfaceof the diamond tool. The sub-micron tool with a cutting edge of 492.19 was manufactured through focused ion beammachining technology. Toshiba ULG-100C(H3) equipment was used to process fine-pattern using the manufacturedultra-precision diamond tool. The ultra-precision machining experiment was conducted according to the machiningdirection, and fine burrs were generated in the pattern in the forward direction. However, no burr occurred during reversemachining. The width of the processed pattern was 480 and the price of the pitch was confirmed to be 1 As aresult of machining.

참고자료

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