ChipPAK license and use FlipChip's bumping technology.Figure 2. Typical PI-RDL WLCSP ConstructionFigure 2 ... ompatible with traditional circuit board assembly processes. WLCSP is essentially a true chip-scale ... -1. 2Layer WLCSP ConstructionRefer to Figure 2 for a representation of a typicalWLCSP package with