나노/마이크로 패턴 제작을 위해 급속열처리가 구리 박막의 기계 가공 특성에 미치는 영향 (The Influence of Rapid Thermal Process on the Machining Properties of Copper Thin Films for Nano/Micro Pattern Fabrication)

서지정보

· 발행기관 : 대한금속·재료학회
· 수록지 정보 : 대한금속·재료학회지 / 62권 / 9호 / 740 ~ 747페이지
· 저자명 : 황해인, 김수연, 조인호, 이승훈, 박아현, 김정환

초록

The semiconductor and display industries employ microfabrication and high-density technologyto enhance the performance of IT products. Current micro-patterning methods primarily rely onphotolithography. However, photolithography is a complex and expensive process, with limited freedom ofpattern design, and involves dry etching methods that use toxic substances, which are harmful to humansand the environment. To address these issues, new alternative patterning technologies are beingresearched. This study proposes precision mechanical machining as an alternative to photolithography.
Machining is an all-in-one process that allows pattern creation using only tools and equipment. It is ecofriendly thanks to its simple and non-chemical process and offers a high degree of pattern freedom.
However, machining can be problematic and destructive when processing brittle materials. This studyattempted to find optimal processing conditions by analyzing machining properties based on the mechanicalproperties of copper metal, which is commonly used in semiconductor wiring. A post-deposition rapidthermal process was used to induce changes in the mechanical properties of a copper thin film, andprocessing was performed to find the optimal conditions. The study found that copper films annealed at400°C had an approximately two-fold increase in crystal size, a 2.8% increase in density, and a 20.4%decrease in hardness. This is because sufficient heat energy promotes crystal growth and removes residualstress, thereby increasing ductility and improving machinability. As a result, fine patterning of thin filmswith clean cut surfaces was possible. Consequently, copper wires can be annealed at over 400°C for precisepatterning. Additionally, not only is the machining depth adjustable, but it is also possible to remove theentire thin film using a critical load. The results of this study confirmed the applicability of nanoscalemachining technology as an alternative to photolithography, and suggest its use in repair processes. Thesefindings provide a foundation for future research aimed at optimizing processing conditions and exploringthe broader potential of this technology across various high-value-added industries beyond semiconductorsand displays.

영어초록

The semiconductor and display industries employ microfabrication and high-density technologyto enhance the performance of IT products. Current micro-patterning methods primarily rely onphotolithography. However, photolithography is a complex and expensive process, with limited freedom ofpattern design, and involves dry etching methods that use toxic substances, which are harmful to humansand the environment. To address these issues, new alternative patterning technologies are beingresearched. This study proposes precision mechanical machining as an alternative to photolithography.
Machining is an all-in-one process that allows pattern creation using only tools and equipment. It is ecofriendly thanks to its simple and non-chemical process and offers a high degree of pattern freedom.
However, machining can be problematic and destructive when processing brittle materials. This studyattempted to find optimal processing conditions by analyzing machining properties based on the mechanicalproperties of copper metal, which is commonly used in semiconductor wiring. A post-deposition rapidthermal process was used to induce changes in the mechanical properties of a copper thin film, andprocessing was performed to find the optimal conditions. The study found that copper films annealed at400°C had an approximately two-fold increase in crystal size, a 2.8% increase in density, and a 20.4%decrease in hardness. This is because sufficient heat energy promotes crystal growth and removes residualstress, thereby increasing ductility and improving machinability. As a result, fine patterning of thin filmswith clean cut surfaces was possible. Consequently, copper wires can be annealed at over 400°C for precisepatterning. Additionally, not only is the machining depth adjustable, but it is also possible to remove theentire thin film using a critical load. The results of this study confirmed the applicability of nanoscalemachining technology as an alternative to photolithography, and suggest its use in repair processes. Thesefindings provide a foundation for future research aimed at optimizing processing conditions and exploringthe broader potential of this technology across various high-value-added industries beyond semiconductorsand displays.

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