FCC, BCC, HCP 특징

문서 내 토픽

• 1. FCC (Face Centered Cubic)

  FCC(Face Centered Cubic)은 면심입방구조로 입방체의 각 꼭짓점과 각 면의 중심에 1개씩의 원자가 배열된 결정구조이다. 원자 충진율은 약 74%이고, 하나의 입자 주위에 가장 가까이 있는 다른 원자의 수(배위수)는 12이다. FCC의 특징은 최대조밀면이 있어 상대적으로 슬립계의 수가 많지만, 최대조밀면이 없는 BCC구조 보다 슬립이 잘 일어나 변형이 잘 일어난다.

• 2. BCC (Body Centered Cubic)

  BCC(Body Centered Cubic)는 면심입방구조로 입방체의 각 꼭짓점과 입방체의 중심에 1개의 원자가 배열된 결정구조이다. 원자 충진율은 약68%이고, 배위수는 8이다. BCC의 특징은 조밀면이 많아 FCC보다 슬립계가 많지만, 최대조밀면이 없어서 슬립계가 적은 FCC보다 슬립이 덜 일어나 상대적으로 취성이 존재한다.

• 3. HCP (Hexagonal Close Packed)

  HCP(Hexagonal Close Packed)는 조밀육방격자로 육강기둥 상하 면의 각 꼭짓점과 그 중심에 한 개씩의 원자가 존재하고, 또한 육각기둥을 구성하는 6개의 삼각 기둥 중에서 1개씩 띄워서 삼각 기둥의 중심에 1개의 원자가 배열된 결정 구조이다. 원자 충진율은 74%이며, 배위수는 12이다. HCP의 특징은 최대조밀면을 가진 조밀면이 있지만 평행의 형태로 가지고 있기 때문에 실제로 1개의 최대조밀면을 가져 슬립이 잘 일어나지 않아 원자배열의 변형이 FCC에 비해 잘 일어나지 않는다.

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• 1. FCC (Face Centered Cubic)

  FCC (Face Centered Cubic) is a crystal structure in which the atoms are arranged in a cubic unit cell, with an atom located at each of the eight corners and one atom at the center of each of the six faces. This structure is commonly found in metals such as copper, gold, silver, and aluminum. The FCC structure is known for its high atomic packing factor, which means that the atoms are closely packed together, resulting in a dense and stable structure. This structure also exhibits good mechanical properties, such as high strength and ductility, making it suitable for various engineering applications. Additionally, the FCC structure is known for its efficient heat transfer and electrical conductivity, making it useful in electronic and thermal management applications.

• 2. BCC (Body Centered Cubic)

  BCC (Body Centered Cubic) is a crystal structure in which the atoms are arranged in a cubic unit cell, with an atom located at the center of the cube in addition to the atoms at the eight corners. This structure is commonly found in metals such as iron, chromium, and tungsten. The BCC structure is known for its relatively low atomic packing factor compared to the FCC structure, but it still exhibits good mechanical properties, such as high strength and hardness. The BCC structure is also known for its good thermal and electrical conductivity, making it useful in various engineering applications, including the production of steel and other alloys. Additionally, the BCC structure is often used in the design of certain types of electronic devices, such as particle accelerators and nuclear reactors.

• 3. HCP (Hexagonal Close Packed)

  HCP (Hexagonal Close Packed) is a crystal structure in which the atoms are arranged in a hexagonal unit cell, with an atom located at each of the six corners and one atom at the center of the cell. This structure is commonly found in metals such as magnesium, titanium, and zinc. The HCP structure is known for its high atomic packing factor, which is similar to the FCC structure, resulting in a dense and stable structure. The HCP structure also exhibits good mechanical properties, such as high strength and corrosion resistance, making it suitable for various engineering applications, including the aerospace and automotive industries. Additionally, the HCP structure is known for its unique thermal and electrical properties, which can be exploited in certain types of electronic devices and materials.