다양한 크기의 솔더 파우더를 이용한 솔더 페이스트의 저장안정성 향상에 관한 연구
(주)코리아스칼라
- 최초 등록일
- 2023.04.05
- 최종 저작일
- 2017.10
- 5페이지/ 어도비 PDF
- 가격 4,000원
* 본 문서는 배포용으로 복사 및 편집이 불가합니다.
서지정보
ㆍ발행기관 : 한국분말야금학회
ㆍ수록지정보 : 한국분말야금학회지 / 24권 / 5호
ㆍ저자명 : 임찬규, 권보석, 남수용, 손민정, 김인영, 양상선
영어 초록
Solder paste is widely used as a conductive adhesive in the electronics industry. In this paper, nano and microsized mixed lead-free solder powder (Sn-Ag-Cu) is used to manufacture solder paste. The purpose of this paper is to improve the storage stability using different types of solvents that are used in fabricating the solder paste. If a solvent of sole acetate is used, the nano sized solder powder and organic acid react and form a Sn-Ag-Cu malonate. These formed malonates create fatty acid soaps. The fatty acid soaps absorb the solvents and while the viscosity of the solder paste rises, the storage stability and reliability decrease. When ethylene glycol, a dihydric alcohol, is used the fatty acid soaps and ethylene glycol react, preventing the further creation of the fatty acid soaps. The prevention of gelation results in an improvement in the solder paste storage ability.
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