습식 교반 및 방전 플라즈마 소결 공정에 의한 CNT 분산 Cu 복합재료 제조
(주)코리아스칼라
- 최초 등록일
- 2023.04.05
- 최종 저작일
- 2018.04
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서지정보
ㆍ발행기관 : 한국분말야금학회
ㆍ수록지정보 : 한국분말야금학회지 / 25권 / 2호
ㆍ저자명 : 조승찬, 조일국, 이상복, 이상관, 최문희, 박재홍, 권한상, 김양도
목차
Abstract
1. 서 론
2. 실험 방법
3. 결과 및 고찰
4. 결 론
References
영어 초록
Multi-walled carbon nanotube (MWCNT)–copper (Cu) composites are successfully fabricated by a combination of a binder-free wet mixing and spark plasma sintering (SPS) process. The SPS is performed under various conditions to investigate optimized processing conditions for minimizing the structural defects of CNTs and densifying the MWCNT–Cu composites. The electrical conductivities of MWCNT–Cu composites are slightly increased for compositions containing up to 1 vol.% CNT and remain above the value for sintered Cu up to 2 vol.% CNT. Uniformly dispersed CNTs in the Cu matrix with clean interfaces between the treated MWCNT and Cu leading to effective electrical transfer from the treated MWCNT to the Cu is believed to be the origin of the improved electrical conductivity of the treated MWCNT–Cu composites. The results indicate the possibility of exploiting CNTs as a contributing reinforcement phase for improving the electrical conductivity and mechanical properties in the Cu matrix composites.
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