Study of complex electrodeposited thin film with multi-layer graphene-coated metal nanoparticles
(주)학지사
- 최초 등록일
- 2017.06.14
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- 2017.01
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서지정보
ㆍ발행기관 : 한국탄소학회
ㆍ수록지정보 : Carbon Letters / 21권
ㆍ저자명 : Young-Lae Cho, Jung-woo Lee, Chan Park, Young-il Song, Su-Jeong Suh
목차
1. Introduction
2. Experimental
3. Results and Discussion
4. Conclusions
References
영어 초록
We have demonstrated the production of thin films containing multilayer graphene-coated
copper nanoparticles (MGCNs) by a commercial electrodeposition method. The MGCNs
were produced by electrical wire explosion, an easily applied technique for creating hybrid
metal nanoparticles. The nanoparticles had average diameters of 10–120 nm and quasispherical
morphologies. We made a complex-electrodeposited copper thin film (CETF) with
a thickness of 4.8 μm by adding 300 ppm MGCNs to the electrolyte solution and performing
electrodeposition. We measured the electric properties and performed corrosion testing of
the CETF. Raman spectroscopy was used to measure the bonding characteristics and estimate
the number of layers in the graphene films. The resistivity of the bare-electrodeposited
copper thin film (BETF) was 2.092 × 10–6 Ω·cm, and the resistivity of the CETF after the addition
of 300 ppm MGCNs was decreased by 2% to ~2.049 × 10–6 Ω·cm. The corrosion resistance
of the BETF was 9.306 Ω, while that of the CETF was increased to 20.04 Ω. Therefore,
the CETF with MGCNs can be used in interconnection circuits for printed circuit boards or
semiconductor devices on the basis of its low resistivity and high corrosion resistance.
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