구리 박막의 표면형상과 물성에 대한 전류밀도 영향
(주)코리아스칼라
- 최초 등록일
- 2016.04.02
- 최종 저작일
- 2010.10
- 4페이지/ 어도비 PDF
- 가격 3,000원
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서지정보
ㆍ발행기관 : 한국재료학회
ㆍ수록지정보 : 한국재료학회지 / 20권 / 10호
ㆍ저자명 : 우태규, 박일송, 정광희, 설경원
영어 초록
This study examined the effect of current density on the surface morphology and physical properties of copper plated on a polyimide (PI) film. The morphology, crystal structure, and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, and a four-point probe, respectively. The surface roughness, crystal growth orientation and resistivity was controlled using current density. Large particles were observed on the surface of the copper layer electroplated onto a current density of 25 mA/cm2. However, a uniform surface and lower resistivity were obtained with a current density of 10 mA/cm2. One of the important properties of FCCL is the flexibility of the copper foil. High flexibility of FCCL was obtained at a low current density rather than a high current density. Moreover, a reasonable current density is 20 mA/cm2 considering the productivity and mechanical properties of copper foil.
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