WLCSP 소개자료-1
- 최초 등록일
- 2012.01.18
- 최종 저작일
- 2012.01
- 11페이지/
MS 파워포인트
- 가격 2,000원
소개글
Wafer Level Chip scale Packgage에 대하여 역사에서부터 제품구조 그리고 실제 제품 Image까지 상세히 작성된 보고서 입니다.
목차
1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3 Construction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
4 Process Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
5 Process Introduction . . . . . . . . . . . . . . . . . . . . 5-6
6 Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
본문내용
2. History
FlipChip International, LLC started out in 1996 as Flip Chip Technologies (FCT), a joint venture
between Delco Electronics Systems and Kulicke & Soffa Industries (K&S). Delco brought the
patented Flex-On-Cap (or FoC) flip chip process and over 30 years of experience from the
automotive industry. K&S added its knowledge and leadership position as the world`s largest
supplier of semiconductor assembly equipment. By any measure, the company was a huge
success. The company’s Flex-on-Cap (FoC) standard flip chip bumping technology quickly
became the industry standard for flip chip bumping.
In 1998, FCT developed and patented the UltraCSP® Wafer Level Chip Scale Package (WL-CSP),
which quickly became the industry standard for WL-CSP. FlipChip began an aggressive licensingprogram to bring its unique bumping technology to a broader worldwide market. Today, the
semiconductor industry’s packaging heavyweights, including Amkor Technology, Advanced
Semiconductor Engineering (ASE), Siliconware (SPIL), and STATS ChipPAK license and use
FlipChip’s bumping technology.
참고 자료
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