One‑step copper electroplating of carbon nanotube buckypaper using optimized electrolyte with additive chemicals

서지정보

ㆍ발행기관 : 한국탄소학회 ㆍ수록지정보 : Carbon letters / 33권 / 4호
ㆍ저자명 : Nilüfer Çakmakçı, Myunggyu Shin, Huiyeon Jung, Jeongyun Lee, Youngjin Jeong

목차

One-step copper electroplating of carbon nanotube buckypaper using optimized electrolyte with additive chemicals
Abstract
Graphical abstract
1 Introduction
2 Materials and methods
2.1 Fabrication of CNT buckypaper (CNTBP)
2.2 Cu-electroplating of CNTBP
2.3 Material and electrochemical characterizations
3 Results and discussion
4 Conclusion
Acknowledgements
References

영어 초록

Nowadays, variable materials have been investigated to find alternative lightweight conductors instead of copper because copper has a relatively high density. Carbon nanotube (CNT) is one of the most suitable materials as an alternative conductor to Cu, thanks to its high conductivity. In addition, CNT has many other great properties, such as low density, high strength, and high ampacity. However, individual CNT loses some of its performance after the assembly process. Therefore, CNT materials have been electroplated with copper to achieve lighter conductors. In this study, CNT buckypaper (CNTBP) is fabricated using a multi-walled carbon nanotube and copper electroplated using optimizing electrolyte with the help of additive chemicals such as accelerator and suppressor. Furthermore, the effect of hydrochloric acid in the electrolyte on the electroplating of CNTBP is observed. The results show that HCl in electrolyte enhances the effectiveness of additive chemicals and provide a well-plated CNTBP@Cu composite. The composite in this study is expected to be used in various areas.

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