포토마스크 펠리클 제조를 위한 Aluminum Frame 표면 세정공정 연구
(주)코리아스칼라
- 최초 등록일
- 2016.04.02
- 최종 저작일
- 2015.09
- 6페이지/ 어도비 PDF
- 가격 4,000원
* 본 문서는 배포용으로 복사 및 편집이 불가합니다.
서지정보
ㆍ발행기관 : 한국재료학회
ㆍ수록지정보 : 한국재료학회지 / 25권 / 9호
ㆍ저자명 : 김현태, 김향란, 김민수, 이준, 장성해, 최인찬, 박진구
영어 초록
Pellicle is defined as a thin transparent film stretched over an aluminum (Al) frame that is glued on one side of a photomask. As semiconductor devices are pursuing higher levels of integration and higher resolution patterns, the cleaning of the Al flame surface is becoming a critical step because the contaminants on the Al flame can cause lithography exposure defects on the wafers. In order to remove these contaminants from the Al frame, a highly concentrated nitric acid (HNO3) solution is used. However, it is difficult to fully remove them, which results in an increase in the Al surface roughness. In this paper, the pellicle frame cleaning is investigated using various cleaning solutions. When the mixture of sulfuric acid (H2SO4), hydrofluoric acid (HF), hydrogen peroxide (H2O2), and deionized water with ultrasonic is used, a high cleaning efficiency is achieved without HNO3. Thus, this cleaning process is suitable for Al frame cleaning and it can also reduce the use of chemicals.
참고 자료
없음
"한국재료학회지"의 다른 논문
더보기 (5/10)