인쇄회로기판용 solder resist의 해상성과 밀착력

서지정보

ㆍ발행기관 : 한국재료학회 ㆍ수록지정보 : 한국재료학회지 / 17권 / 12호
ㆍ저자명 : 최성호, 황성진, 김형순

영어 초록

According to progress rapidly digitalization, networked and mobilization of electronics industry, there are demands for being smaller, thinner, more light, and more efficient complex functions of electronic devices which are wireless devices, semi-conductors, packages and mobile devices. Therefore, the solder resist on a printed circuit board have been required with the high resolution and the eco-friendly materials in the surface treatments such as high heating process and coating process with electrolysis. In this study, the photoinitiator initiator and monomers of the solder resist were prepared with their contents for reducing the occurrence of the under-cut. We investigated the sample surface by UV/VIS spectrometer, FT-IR, OM after HASL and ENIG process. From our results, it is possible to get a high adhesion of resist with optimal contents between the photoinitiator initiator and monomers after surface treatments.

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