경화촉매 분말의 입도조절 및 표면코팅에 의한 에폭시 레진 기반 혼합조성의 상온 보관특성 개선
(주)코리아스칼라
- 최초 등록일
- 2016.04.01
- 최종 저작일
- 2008.04
- 6페이지/ 어도비 PDF
- 가격 4,000원
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서지정보
ㆍ발행기관 : 한국분말야금학회
ㆍ수록지정보 : 한국분말야금학회지 / 15권 / 2호
ㆍ저자명 : 이준식, 현창용, 이종현
영어 초록
To increase pot life in the formulation mixed with bisphenol F epoxy resin, anhydride-based curing agent, and imidazole-based curing accelerator powders as a paste material for high-speed RFID chip bonding, size variation of the imidazole-based powders and a coating method of the powders were adopted in this study. In experiment with regard to the size variation, the pot life was not outstandingly increased. Through the idea using the coating method, however, the pot life was increased up to 4.25 times in comparison with the addition of initial imidazole-based powders. Consequently, successive bonding of RFID chip could be performed with very short time of 5sec using the suggested formulation having improved pot life.
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