Polyimide-POSS nanocomposites에 대한 계면접착력, 열 기계적 성질
- 최초 등록일
- 2007.02.13
- 최종 저작일
- 2007.02
- 18페이지/ MS 파워포인트
- 가격 1,000원
소개글
Polyimide-POSS nanocomposites에 대한 계면접착력, 열 기계적 성질의 분석에 관한 논문을
세미나 발표자료 형식으로 만들어 발표했던 자료입니다.
Polyimide/POSS nanocomposites: interfacial interaction, thermal
properties and mechanical properties (Polymer 44 (2003) 4491–4499)
목차
Polyimide/POSS nanocomposites:
interfacial interaction, thermal properties and mechanical properties
○ Introduction
► Polyimides (PIs)
► PIs require at circuit-printing films and semiconductor coatings
► Organic–inorganic nanocomposite materials
► Sol–gel process
► What is the POSS?
○ In this study...
○ Experimental part
2.1. Materials
2.2. Instrumentation
► Preparation of OPS, ONP, OAPS
2.6. Preparation of PI–POSS nanocomposites
► The preparation formulation of the PI–POSS nanocomposites
○ Results and discussion
3.1. Structure of POSS [ONP]
3.2. PI–POSS nanocomposites
► Octa(phthalimidephenyl)silsesquioxane [OPIPS]
► Dynamic mechanic analyses (DMA)
► The thermal stability (TGA)
► Thermo mechanical analyses (TMA)
► Mechanical properties (UTM)
○ Conclusions
본문내용
► Polyimides (PIs)
Excellent tensile strength and modulus
Good thermal stability
Dielectric property
Good resistance to organic solvents
► PIs require at circuit-printing films and semiconductor coatings
Lower CTE (coefficient of thermal expansion)
High Tg
Better thermal mechanical strength
(to avoid debonding PI-inorganic substance and flaws in the PI interlayer)
> 무기물과 나노복합체를 형성함으로 PI의 열/기계적 성질을 향상 시킬 수 있다.
참고 자료
Polyimide/POSS nanocomposites:interfacial interaction, thermal properties and mechanical properties
(Polymer 44 (2003) 4491–4499)
Author: Jun-chao Huang, Chao-bin He, Yang Xiao, Khine Yi Mya, Jie Dai, Yeen Ping Siow