TFT-LCD 백라이트 유닛(BLU) 램프용 전극 미세 접합부의 강도 및 미세조직
(주)코리아스칼라
- 최초 등록일
- 2016.04.02
- 최종 저작일
- 2009.01
- 6페이지/ 어도비 PDF
- 가격 4,000원
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서지정보
ㆍ발행기관 : 한국재료학회
ㆍ수록지정보 : 한국재료학회지 / 19권 / 1호
ㆍ저자명 : 김광수, 김상덕
영어 초록
TFT-LCD is the most popular type of flat display panel in the information technology field. The back light unit is a main part of the structure of a TFT-LCD panel. Occasionally, studies have shown that failures of the CCFL of the BLU occur due to the poor weld characteristics of these materials. The aim of this study was to prepare some technical data and to characterize a microjoined electrode for the CCFL. Microstructure examinations, microhardness measurements, resistance measurements and microtensile tests of the microjoined electrode were carried out. The result indicates that a large amount of grain coarsening exists in the heat-affected zone (HAZ) of the weld between the cup and the pin. This grain coarsening of the HAZ between the cup and pin is caused by the welding cycle, which may have an influence on the lowest microhardness values. Fracturing of the microjoined electrode also occurred at the HAZ close to the cup between the weld holding the cup and the pin. Additionally, no specific changes of the electrical resistance among the cup, pin, and lead wire themselves or in the microjoined electrode were observed.
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