Low Temperature Debinding Process Using Oxygen Plasma for Flexible Printed Electronics
(주)코리아스칼라
- 최초 등록일
- 2016.04.01
- 최종 저작일
- 2012.10
- 5페이지/ 어도비 PDF
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서지정보
ㆍ발행기관 : 한국분말야금학회
ㆍ수록지정보 : 한국분말야금학회지 / 19권 / 5호
ㆍ저자명 : Lee Young-In
영어 초록
In this study, an oxygen plasma treatment was used as a low temperature debinding method to form a conductive copper feature on a flexible substrate using a direct printing process. To demonstrate this concept, conductive copper patterns were formed on polyimide films using a copper nanoparticle-based paste with polymeric binders and dispersing agents and a screen printing method. Thermal and oxygen plasma treatments were utilized to remove the polymeric vehicle before a sintering of copper nanoparticles. The effect of the debinding methods on the phase, microstructure and electrical conductivity of the screen-printed patterns was systematically investigated by FE-SEM, TGA, XRD and four-point probe analysis. The patterns formed using oxygen plasma debinding showed the well-developed microstructure and the superior electrical conductivity compared with those of using thermal debinding.
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